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Reply To: | TechNet E-Mail Forum. |
Date: | Mon, 6 Jul 1998 12:58:01 -0600 |
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We have tried that, but apparently (this CCA is being built at an
outside contractor), the component sits too high off the PWB for a good
center solder connection, so the design engineer would like me to
research conductive epoxies. Know of any?
>----------
>From: Chan, Marcelo[SMTP:[log in to unmask]]
>Reply To: "TechNet E-Mail Forum." <[log in to unmask]>,"Chan, Marcelo"
>Sent: Monday, July 06, 1998 9:55 AM
>To: [log in to unmask]
>Subject: Re: [TN] ASSY: Thermally/Electrically Conductive Epoxy
>
>can't you provide an stencil aperture for the component underside and use
>solder
>for that interconnection so as to not add a dispensing process to your
>process
>flow...if done correctly, you should not have any intermittent
>connections...some of the problems with using conductive adhesives are CTE
>mismatches, depending on the paste you may have issues with rosin residues,
>forming adequate fillets around the component and probably most
>important...rework!
>
>Marcelo
>
> -----Original Message-----
> From: Jan Satterfield [SMTP:[log in to unmask]]
> Sent: Monday, July 06, 1998 11:30 AM
> To: [log in to unmask]
> Subject: [TN] ASSY: Thermally/Electrically Conductive Epoxy
>
> We have an RF component that contains a metal pad on the underside of
> the component that is soldered to a pad on the pwb. After reflow we
>are
> getting intermittent connections. I need to find a thermally and
> electrically conductive epoxy that I can use to bond the metal pad to
> the pwb and will then withstand the temperatures of reflow while the
> leads are soldered. This epoxy will need to be applied with a
>dispenser
> due to high volume.
>
> Any suggestions or vendors that I might contact?
>
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