We have tried that, but apparently (this CCA is being built at an outside contractor), the component sits too high off the PWB for a good center solder connection, so the design engineer would like me to research conductive epoxies. Know of any? >---------- >From: Chan, Marcelo[SMTP:[log in to unmask]] >Reply To: "TechNet E-Mail Forum." <[log in to unmask]>,"Chan, Marcelo" >Sent: Monday, July 06, 1998 9:55 AM >To: [log in to unmask] >Subject: Re: [TN] ASSY: Thermally/Electrically Conductive Epoxy > >can't you provide an stencil aperture for the component underside and use >solder >for that interconnection so as to not add a dispensing process to your >process >flow...if done correctly, you should not have any intermittent >connections...some of the problems with using conductive adhesives are CTE >mismatches, depending on the paste you may have issues with rosin residues, >forming adequate fillets around the component and probably most >important...rework! > >Marcelo > > -----Original Message----- > From: Jan Satterfield [SMTP:[log in to unmask]] > Sent: Monday, July 06, 1998 11:30 AM > To: [log in to unmask] > Subject: [TN] ASSY: Thermally/Electrically Conductive Epoxy > > We have an RF component that contains a metal pad on the underside of > the component that is soldered to a pad on the pwb. After reflow we >are > getting intermittent connections. I need to find a thermally and > electrically conductive epoxy that I can use to bond the metal pad to > the pwb and will then withstand the temperatures of reflow while the > leads are soldered. This epoxy will need to be applied with a >dispenser > due to high volume. > > Any suggestions or vendors that I might contact? > > ################################################################ > TechNet E-Mail Forum provided as a free service by IPC using LISTSERV >1.8c > ################################################################ > To subscribe/unsubscribe, send a message to [log in to unmask] with >following text in the body: > To subscribe: SUBSCRIBE TechNet <your full name> > To unsubscribe: SIGNOFF TechNet > ################################################################ > Please visit IPC's web site (http://www.ipc.org) "On-Line Services" >section for additional information. > For technical support contact Hugo Scaramuzza at [log in to unmask] or >847-509-9700 ext.312 > ################################################################ > >################################################################ >TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c >################################################################ >To subscribe/unsubscribe, send a message to [log in to unmask] with following >text in the body: >To subscribe: SUBSCRIBE TechNet <your full name> >To unsubscribe: SIGNOFF TechNet >################################################################ >Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section >for additional information. >For technical support contact Hugo Scaramuzza at [log in to unmask] or >847-509-9700 ext.312 >################################################################ > > ################################################################ TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c ################################################################ To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body: To subscribe: SUBSCRIBE TechNet <your full name> To unsubscribe: SIGNOFF TechNet ################################################################ Please visit IPC's web site (http://www.ipc.org) "On-Line Services" section for additional information. For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312 ################################################################