Hi everyone,
We have a PCB supplier who is offering "Hard Gold" as an alternate to ENIG finish, due to PCB size and processing capabilities. The application is Class 3 (mil/aero). The circuit is thin FR4 and subject to SMT reflow w/ Sn63Pb37 (non RoHS) solder alloy, and moderate flexing in end application.
Can anyone offer info on the differences between the two finishes, and/or their suitability? Is there an IPC spec (or specs) that outline "hard gold"?
Thanks,
Kevin Glidden
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