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March 2002

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Subject:
From:
George Milad <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 11 Mar 2002 19:14:41 EST
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The Plating Subcommittee 4-14 will meet at Expo 2002 in Longbeach CA , on
Tuesday March 26th,2002 at 1:30 - 5:00pm.

The subcommittee is reviewing comments to a final draft IPC-4552,
"Specifications for Electroless Nickel/Immersion Gold (ENIG) Plating for
Printed Circuits Boards" and is also pursuing UL Recognition of Immersion
Silver surface finishes for printed wiring boards in conjunction with the UL
Task Group,3-11f.

The agenda will include updates on existing activities and the determination
of the next topic for "Standard Development". Presently on the list are
additional "Surface Finish" specifications, however the committee is open to
suggestions and priorities from the membership.

As part of the standards development working meetings, you can help develop
internationally recognized documents for PWB component and materials. You'll
be on the cutting edge of PWB design, manufacture and use.

The committee welcomes your contribution and your input.

George Milad
HDI Consulting


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