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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 4 May 2004 14:17:39 +0100 |
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Folks,
We've just carried out some qualification tests on a socket which was reflow
soldered to a board whose pads were plated with Ni/Au. As far as I know a
'standard' Sn/Pb solder was used.
The results of the salt spray test were not a pretty sight. The solder
joints corroded to a point where, in some cases, the socket fell off the
board.
Is Ni/Au a particularly bad finish for corrosion resistance and, if so, what
would be the best?
Alternatively is Ni/Au generally good but are there any defects in the
plating/pcb that can cause a failure in such a test?
Also, does anyone know if the corrosion resistance of lead free alloys are
better or worse than the Sn/Pb we all know and love?
Thanks,
Eric Christison Msc
Mechanical Engineer
Consumer & Micro Group - Imaging Division
STMicroelectronics
33 Pinkhill
Edinburgh
EH12 7BF
UK
Tel: +44 (0) 131 336 6165
Fax: +44 (0) 131 336 6001
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