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February 2004

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"TechNet (E-mail)" <[log in to unmask]>
Date:
Tue, 17 Feb 2004 17:56:12 -0600
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"TechNet E-Mail Forum." <[log in to unmask]>, Charles Caswell <[log in to unmask]>
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Charles Caswell <[log in to unmask]>
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We have a new assy. that uses 1206 capacitor networks. We are have a serious
problem with bridging and unsoldered connections. We think we may have solved
the non soldered problem by increasing the soak before reflow but still have
the bridging. Anybody have similar experiences? We are using a 5 mil.
stencil. The other parts all seem to solder well. We are considering having
the apertures for these parts reduced. Any suggestions would be greatly
appreciated. 

Charles Caswell
The Big Kahuna

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