No soldering material of any kind is used in wire bonding.
It is based on the compatibility of metals and their ability to fuse into
each using ultrasound energy for aluminum wire and heat the ultrasound for
bonding gold wire.
For your info ENIG is a good surface for aluminum wire bonding, not so for
gold wire bonding.


Best  regards

George Milad
[log in to unmask]
National Accounts Manager  for Technology
Uyemura International Corporation
Technical Center
240  Town LIne Rd
Southington CT 06489
(516) 901 3874 (mobile)
(860)  793-4011 (office)
(860) 793-4020 (fax)

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