No soldering material of any kind is used in wire bonding. It is based on the compatibility of metals and their ability to fuse into each using ultrasound energy for aluminum wire and heat the ultrasound for bonding gold wire. For your info ENIG is a good surface for aluminum wire bonding, not so for gold wire bonding. Best regards George Milad [log in to unmask] National Accounts Manager for Technology Uyemura International Corporation Technical Center 240 Town LIne Rd Southington CT 06489 (516) 901 3874 (mobile) (860) 793-4011 (office) (860) 793-4020 (fax) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------