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Date: | Fri, 26 Apr 96 07:37:36 cst |
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The IPC Solderability task groups and the Alternative Solderable
Finishes task group are currently looking at a number of non-tin/lead
finishes in relationship to solderability requirements. The committees
have not brought anything to the discussion table yet but some
proposals should be forth coming. Traditionally, the specifications
have required that gold pass a one hour steam age conditioning
followed by 95% minimum coverage with a dip and look test. The IPC
Steam Aging Task group will be publishing a report this fall at IPC
Techworks that shows gold finishes can pass 8 hours of steam aging
without failing. However, industry in general and I personally don't
think that steam aging is the finish durability conditioning method of
choice. It has been my experience that there is good gold and bad gold
- you need to work closely with your plating source to understand
their plating process/chemistry and characterize how that fits your
product and the product use environment. I have found that in some
manufacturing environments that your 150 Ni and 5 Au thicknesses would
be adequate.
Dave Hillman
Rockwell Collins
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Subject: IPC specs for e'less Ni/imm Au
Author: [log in to unmask] at ccmgw1
Date: 4/24/96 9:19 PM
Is there an IPC specs for the minimum thickness of electroless Ni/immersion
Au PCB finish for solderability application? Is 150u" for electroless Ni &
5u" for immersion gold the norm in the industry? Please advice. Thanks in
advance!
B.H. Lee
Process Engineer
Singapore
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