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by ipc.org (Smail3.1.28.1 #2)
id m0tMdV1-0000MXC; Mon, 4 Dec 95 10:12 CST |
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MEMO 1995/12/04 11:10 |
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04 Dec 1995 11:02:11 EST |
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24:27 1996 |
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I know that the use of foil lamination helps increase
thru-put for inner-layer processing at the PWB fabricator.
But, from a PWB performance and reliability standpoint, what
are the pros and cons of foil lamination over a "core"
stack-up??
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