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Date: | Thu, 19 Jun 2008 17:30:04 EDT |
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Hi Vladimir,
Would you have a problem with defining BP as follows: An interfacial
separation with the PCB/component-side fracture surface showing nickel and more than
5wt% of phosphorous and the other fracture surface attached to the solder
volume showing either SnNi/SnCuNi-IMC or solder and more than 5wt% of P.
Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18,
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22,
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture,
ENIG), September 22, Schaumburg
**************
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fuel-efficient used cars.
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