Hi Vladimir,
Would you have a problem with defining BP as follows: An interfacial 
separation with the PCB/component-side fracture surface showing nickel and more than 
5wt% of phosphorous and the other fracture surface attached to the solder 
volume showing either SnNi/SnCuNi-IMC or solder and more than 5wt% of P.

Werner Engelmaier
Future workshops:
Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland
Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, 
Orlando
Reliability Issues with Lead-Free Soldering Processes, September 22, 
Schaumburg
Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, 
ENIG), September 22, Schaumburg



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