Hi Vladimir, Would you have a problem with defining BP as follows: An interfacial separation with the PCB/component-side fracture surface showing nickel and more than 5wt% of phosphorous and the other fracture surface attached to the solder volume showing either SnNi/SnCuNi-IMC or solder and more than 5wt% of P. Werner Engelmaier Future workshops: Solder Joint Reliability: Parts 1 through 4, July 17/18, Thal, Switzerland Pb-Free Soldering Processes—Survival, Quality, Reliability, August 18, Orlando Reliability Issues with Lead-Free Soldering Processes, September 22, Schaumburg Failure Mode and Root Cause Analyses Reliability (Fatigue, Brittle Fracture, ENIG), September 22, Schaumburg ************** Gas prices getting you down? Search AOL Autos for fuel-efficient used cars. (http://autos.aol.com/used?ncid=aolaut00050000000007) --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------