You probably are :-) , BUT Ni has nothing to do with BP
Vladimir
-----Original Message-----
From: TechNet
To: [log in to unmask]
Sent: Wed Jun 13 14:31:03 2007
Subject: Re: [TN] Nickel barrier and RF applications
And it precipitates, not participates. The only thing nickel
participates in is creating brittle-nickel syndrome and BP! Ain't I an
old fussy fluxxer!
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D.
Sent: Wednesday, June 13, 2007 12:57 PM
To: [log in to unmask]
Subject: Re: [TN] Nickel barrier and RF applications
Inge and Vlad
Keep in mind that Paymon is reflowing the entire assembly, not just
reworking a BGA site.
Therefore what you just described is happening over the entire assembly
to all of the solder joints.
This cumulative effect could theoretically create a noticeable
improvement in the RF performance of the circuitry.
-----Original Message-----
From: Hfjord [mailto:[log in to unmask]]
Sent: Wednesday, June 13, 2007 12:13 PM
To: 'TechNet E-Mail Forum'; Stadem, Richard D.
Subject: SV: [TN] Nickel barrier and RF applications
For each repeated reflow, more and more nickel participates in building
nickel/tin intermetallics. These IMCs are not ferromagnetic. So, let's
assume that Paymon's electroless nickel is just some 2-3 micrometers
thick, which is not unusual, then a growth of the IMC by some 0.1 to 0.5
micrometer for each reflow will probably have a positive effect = less
magnetic.
Just an analogue thought
Inge
I think, there is one question to ask. If ENIG (or rather the presence
of Ni) is the source of the problem, then why does 2nd reflow improves
the yield?
Regards,
Vladimir
AMD
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