You probably are :-) , BUT Ni has nothing to do with BP Vladimir -----Original Message----- From: TechNet To: [log in to unmask] Sent: Wed Jun 13 14:31:03 2007 Subject: Re: [TN] Nickel barrier and RF applications And it precipitates, not participates. The only thing nickel participates in is creating brittle-nickel syndrome and BP! Ain't I an old fussy fluxxer! -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Stadem, Richard D. Sent: Wednesday, June 13, 2007 12:57 PM To: [log in to unmask] Subject: Re: [TN] Nickel barrier and RF applications Inge and Vlad Keep in mind that Paymon is reflowing the entire assembly, not just reworking a BGA site. Therefore what you just described is happening over the entire assembly to all of the solder joints. This cumulative effect could theoretically create a noticeable improvement in the RF performance of the circuitry. -----Original Message----- From: Hfjord [mailto:[log in to unmask]] Sent: Wednesday, June 13, 2007 12:13 PM To: 'TechNet E-Mail Forum'; Stadem, Richard D. Subject: SV: [TN] Nickel barrier and RF applications For each repeated reflow, more and more nickel participates in building nickel/tin intermetallics. These IMCs are not ferromagnetic. So, let's assume that Paymon's electroless nickel is just some 2-3 micrometers thick, which is not unusual, then a growth of the IMC by some 0.1 to 0.5 micrometer for each reflow will probably have a positive effect = less magnetic. Just an analogue thought Inge I think, there is one question to ask. If ENIG (or rather the presence of Ni) is the source of the problem, then why does 2nd reflow improves the yield? Regards, Vladimir AMD --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------