TECHNET Archives

July 2001

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
[log in to unmask]
Date:
Fri, 6 Jul 2001 11:02:09 -0400
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, Guy Ramsey <[log in to unmask]>
Subject:
Re: J-STD-002 and -003 solderability testing...
From:
Guy Ramsey <[log in to unmask]>
In-Reply-To:
<[log in to unmask]>
Content-Type:
multipart/alternative; boundary="----=_NextPart_000_0034_01C1060B.1A293680"
MIME-Version:
1.0
Parts/Attachments:
text/plain (4 kB) , text/html (5 kB)

ATOM RSS1 RSS2