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April 1997

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Subject:
FAB: Peel strength for BUMs
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text/plain (34 lines) 
A while back someone asked about enhancing peel strength for built-up
multilayer (BUM) boards.  It is possible that a process being investigated at 
Sandia for polyimides could be applied to BUM fabrication.

Anyone interested in discussing detailed requirements can contact me
off-line.  I would be interested in knowing which solder-mask materials
you are using for the dielectric layers and the suppliers and chemical makeup
of the materials.  Perhaps some samples could be provided to Sandia for 
experiments and evaluation if there is enough interest in the industry.

Gary P.
---
                                  Gary D. Peterson
    _/_/_/   _/    _/  _/        SANDIA NATIONAL LABORATORIES     _/_/_/
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