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January 2019

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Mon, 7 Jan 2019 09:36:45 -0600
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TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
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Nigel Burtt <[log in to unmask]>
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Came across this terminology in a 2017 paper.

https://ieeexplore.ieee.org/document/8046760

" The constant residue level at small sample size was attributed to the surface adsorption phenomenon, or “Flux Shell” phenomenon, where a layer of flux was strongly adsorbed on the solder powder surface"

This isn't a phenomenon I have seen referred to elsewhere, does anyone have a description of the formation of this shell and its impact?

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