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September 2001

TechNet@IPC.ORG
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Subject:
Solder paste qualification
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 12 Sep 2001 12:04:24 -0400
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I am looking for help with the process of solder paste qualification.
Anyone, have input beyond IPC-J-STD-005 and the related Test Methods? A
check list that they would be willing to share. I have been tasked with
writing an article to appear in our newsletter and would be happy to give
credit for any ideas that I use.

Guy Ramsey
Senior Lab Technician / Instructor


E-Mail: [log in to unmask]
Ph: (610) 362-1200 x107
Fax: (610) 362-1290

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