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March 1999

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Sender:
TechNet <[log in to unmask]>
Date:
Mon, 29 Mar 1999 09:50:13 +0000
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, John Parsons <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
Solder Filled Vias - Motorola PLD 1.5 Power Surface Mount Packag
MIME-Version:
1.0
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7BIT
Organization:
Circuit Graphics Ltd.
From:
John Parsons <[log in to unmask]>
Parts/Attachments:
text/plain (26 lines) 
Good Morning,

Does anyone, fab shops to designers, have any experience with
designing, manufacturing or end use of solder filled vias for thermal
management as detailed in Motorola's App Note AN4005/D

Any information including problems encountered or tips would be
appreciated.

Regards

John Parsons
Circuit Graphics Ltd.

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