Fellow Techies,

Hopefully, someone can shed some light on my concern about rinsing boards
(soldered with water soluble flux) with softened water vs. DI water.

A board assembly house suggested that it is acceptable to do in-process
rinsing using "softened" water (in an in-line cleaner) and save the "DI
water" rinse for the FINAL in-line cleaning.  In-process cleaning would be
for example after the 1st side is soldered on a double sided board.  Seems
like a lot of extra work to me switching from softened to DI water.

Look forward to your comments.

thanks
joe

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