Subject: | |
From: | |
Reply To: | |
Date: | Tue, 24 Jan 2006 13:18:26 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Victor - as part of a Pb-free consortia back in 1999/2000, we tested ENIG
with multiple surface finishes on components and different alloys. Parts
were thermally cycled from -55C to 125C for 1000 hours. Data was published
at IPC fall show in Miami - cannot remember the year but I am sure someone
on the net does.
Regards
Gerard O'Brien
Photocircuits Corporation
-----Original Message-----
From: Victor G. Hernandez [mailto:[log in to unmask]]
Sent: Tuesday, January 24, 2006 12:50 PM
To: [log in to unmask]
Subject: [TN] Immersion Gold and LF PROCESS
Fellow TechNetters:
Can someone share any reliability data they have come across with
regards to a sound
metallurgical solder joint with regards to IAu and LF Process?
Victor,
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16
for additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|