Subject: | |
From: | |
Reply To: | |
Date: | Fri, 29 Jul 2011 11:19:51 -0400 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Low Temp Co-fired Ceramics [LTCC], or high temp co-fired ceramics [HTCC]
Steve Creswick
Sr Associate - Balanced Enterprise Solutions
http://www.linkedin.com/in/stevencreswick
616 834 1883
-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Kenneth J. Wood
Sent: Friday, July 29, 2011 9:52 AM
To: [log in to unmask]
Subject: [TN] High Vacuum Substrate
Hi all,
I have a PCB that operates inside a vacuum chamber under ultra high vacuum.
The material can't outgas and needs to hold up physically under the pressure
(or lack thereof).
I wanted to use RO3003 but may need something else, any suggestions?
Material lead time is an issue as well which is why I'm looking...
Thanks
Ken
_____________________________________
Kenneth J. Wood
Saturn PCB Design, Inc.
www.saturnpcb.com
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or
847-615-7100 ext.2815
-----------------------------------------------------
______________________________________________________________________
This email has been scanned by the MessageLabs Email Security System.
For more information please contact helpdesk at x2960 or [log in to unmask]
______________________________________________________________________
---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 16.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
For additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------
|
|
|