Fellow TechNetters,
I am searching for an epoxy adhesive with a Fast cure/set time and
High tensile pull.
J-B Weld Part A&B and water bond, malleable core, works well but the
cure/set time is too long.
Adheres well to wet surface.
This epoxy will be used to conduct Pull Test on Plastic BGA device
substrates wit and w/o built in heat sinks.
Victor,
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