Rick,
I would say,that increasing of annular ring for controlling of plated copper
is strange way.The hole size is rather big.There are some ways to improve
copper ballance on the surface for pattern plating such as current thiefs or
just by manipulation of current dencities and plating time.
Regards
Edward

Edward Szpruch
Eltek Ltd
P.O.Box 159 ; 49101 Petah Tikva Israel
Tel  ++972 3 9395050 , Fax  ++972 3 9309581
e-mail   [log in to unmask]

> -----Original Message-----
> From: Elensky, Richard [SMTP:[log in to unmask]]
> Sent: á éðåàø 07 2002 23:52
> To:   [log in to unmask]
> Subject:      [TN] PCB Fab Question
> 
> Good Day to all,
> 
>         My PCB fab house has been trying to correct an issue regarding the
> finished size of a PTH.  In our discussions, they mentioned an item I
> don't
> quite understand and thought I would utilize the vast knowledge of forum
> to
> get an Educated opinion... (I understand the risks involved with that
> method)
> 
> We are using HASL finished boards, 8 layers, .125" thick.  Nothing too
> wild
> there.
> 
>         The fab house stated they could better control the tolerance
> (+.003
> / -0) on a PTH if the annular ring were larger.  The current ring is about
> .012" larger than the radius of the hole (.213).  They wish to increase
> the
> ring by .010" to.015" as a means of controlling the amount of plating
> applied to the inside of the PTH.
> 
>         Is this possible??  Does the annular ring have that much control
> on
> the amount of plating applied to the barrel of the PTH?  Are they blowing
> smoke to cover a process related issue?
> 
> Thank you for your interest.
> 
> Rich
> 
> 
> Richard Elensky
> Sr. Manufacturing Engineer
> [log in to unmask] <mailto:[log in to unmask]>
> 
> Tel:  559-292-1111  x246
> Fax:  559-292-9355
> 
> Dantel
> 2991 North Argyle Ave.
> Fresno, CA, 93727
> Visit our web site at:
> http:// www.dantel.com <http://www.dantel.com>
> 
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