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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 7 Mar 2002 18:07:29 EST |
Content-Type: | multipart/alternative |
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Or Stablcor...
-Steve Gregory-
> time for thermount.
>
> -----Original Message-----
> From: Marsico, James [mailto:[log in to unmask]]
> Sent: Thursday, March 07, 2002 1:07 PM
> To: [log in to unmask]
> Subject: [TN] CIC... ONCE AGAIN
>
>
> Remember all of those e-mails back in November regarding MLBs with CIC
> layers? Well, it's time again... We went ahead and designed a CIC board,
> mainly because our present board house said "no problem, we do it all the
> time". Well, he fell on his face and now, 3 months after placing the order,
> he can't deliver. Obviously, he has little, if any, experience with CIC.
> His problem is "...inserting the invar material into the copper tanks kills
> the solution and provide no plating". He is suggesting gold plating the
> vias first, then copper plating. Has anyone ever heard of this before? Is
> this a viable solution? Anyway, we're now looking for a new board supplier
> who HAS experience with CIC. Any recommendations? This is a prototype run
> of 5 boards only.
>
> Thanks again for all your help,
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> EDO Electronics Systems Group
> [log in to unmask] <mailto:[log in to unmask]>
> 631-595-5879
>
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