 
| Mime-Version: |
1.0 |
| Content-Type: |
text/plain; charset="us-ascii" |
| Old-Return-Path: |
|
| Date: |
Wed, 1 May 1996 11:38:35 -0500 |
| Precedence: |
list |
| Resent-From: |
|
| Resent-Sender: |
|
| X-Status: |
|
| Status: |
RO |
| X-Mailing-List: |
|
| From [log in to unmask] Thu May 2 12: |
06:53 1996 |
| X-Sender: |
|
| TO: |
|
| Return-Path: |
<TechNet-request> |
| Resent-Message-ID: |
<"fSBIB1.0.R8B.KBvXn"@ipc> |
| Subject: |
|
| From: |
|
| X-Loop: |
|
| Received: |
by ipc.org (Smail3.1.28.1 #2)
id m0uEesI-00007lC; Wed, 1 May 96 11:35 CDT |
| X-Mailer: |
Windows Eudora Light Version 1.5.2 |
| Message-Id: |
|
| Parts/Attachments: |
|
|
All,
One our very best and long time PCB suppliers as asked us to consider
approving a new process for preparing plated through holes before
metalization. Instead of depositing copper for the base, they deposit some
sort of carbon or graphite base upon which thye eventually elctro-plate
copper. The only visible result on the finished board is that unplated
holes are black.
Anyone have any comments, ideas or concerns about this type of process?
Apparently "Shadow" is a brand name for a generic process called carbon
sensitization.
Thank you in advance for your consideration.
Leo Reynolds
|
|
|
