Kiet,

        I dont know the device in question, but when the EFO does its
     thing, it should be a good way off the die, so any chance of a direct
     arc is minimal, and you should be able to see it.  I dont know if the
     spark would damage the die through static, EMC etc as thats not my
     field.

        Also, dont just consider the obvious, are the die good when you get
     them? and immediatly before you try and bond them? Ive seen this
     before where there were "known questionable die" and the bonding was
     being blamed.  It could be worth cheking the mechanical quality of the
     bond, are you getting cratering to any degree, or damage to the
     metallisation from vibration etc, if so review the bond parameters.

                Good luck,
                     Roger



______________________________ Reply Separator _________________________________
Subject: [TN] Ball Bonding
Author:  "TechNet E-Mail Forum." <[log in to unmask]> at #email
Date:    29/06/99 13:52


     Hello All,
     I'm trying to find the cause for blowing GaAS Ka-Band MMIC power
amplifier
     in our hybrid assembly process. One of the most suspicious process is
auto
     ball bonding, Hughes model 2460-IV. My question is What is the
possibility
     of the EFO from the ball bonder can zap the MMIC?

     Thanks in advance,
     Kiet Dang
     Stellex Microwave System
     [log in to unmask]