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| From [log in to unmask] Tue Oct 1 09: |
11:38 1996 |
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>Date: Fri, 27 Sep 1996 16:13:41 -0500
>To: [log in to unmask]
>From: [log in to unmask]
>Subject: FAB: Bonding Plating
>Cc: Reese. Spencer D.
>
>
>
>What types of electroless chemistries are available that can accommodate
gold ball and aluminum wedge bonding, other than a soft gold. Whose
chemistries are they and who are the fabricators with these capabilities?
>
>Thanx for info in advance......
>
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