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June 2000

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From:
Anil Kher <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 23 Jun 2000 12:18:05 +0530
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Have you heard of a customer who blamed the PCBs for poor fillet formation - inspite of complete wetting of land and another one who said that solder bridging on DIP was solely on account of the PCBs.- when the shop floor had sub optimal wave soldering process with cards going on the wave at 70 degC.- an dthe machine open to air draft - in front of a window at that.

It takes all kinds - But Werner hit the nail on the head - to add - with increased productivity ( lesser people  working longer hours) there is no time to stand and stare and of course the great ISO systems that need corrective action reports and source of defect to be marked on a paper - the fall guy is the stupid PCB fab guy - who is of course far away - the end is find a new fab guy and that solves the problem which solves itself
Anil Kher
    
  ----- Original Message ----- 
  From: Werner Engelmaier 
  To: [log in to unmask] 
  Sent: Thursday, June 22, 2000 9:59 PM
  Subject: Re: [TN] Ag on Ni - effect of baking in sun , related tech conten t


  Hi Paul,
  Don't knock my 5-iron, it's my favorite--now my 2-iron, that one I leave in
  the garage.
  Now, if you quote Dan Quayle, you have to give at least equal time to Bill
  Clinton--do YOU know "what the definition if 'is' is"?
  The problem with our industry is that after all that down-sizing and
  out-sourcing the OEM's no longer have any in-house expertise, the PCB and
  assembly vendors work on such tight margins that relatively little 'thinking'
  can be afforded--and so things go wrong. Things wind up in
  litigation/arbitration, which make lawyers rich (expert witnesses, like me,
  somewhat less so), and are generally unsatisfactory as far as really solving
  problems is concerned.
  Have fun down under!
  Werner

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