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July 2006

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Subject:
From:
Martin Butcher <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Martin Butcher <[log in to unmask]>
Date:
Thu, 20 Jul 2006 10:19:32 -0700
Content-Type:
text/plain
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text/plain (76 lines)
I've seen clamp/pallets that are spring loaded to make solid contact with
the pads and balls.

Best of luck,
Martin Butcher
Process Engineer

-----Original Message-----
From: Macko, Joe @ IEC [mailto:[log in to unmask]]
Sent: Thursday, July 20, 2006 10:16 AM
To: [log in to unmask]
Subject: [TN] temporary attachment of a BGA to a PCB for test


Fellow techs,



I have been asked to determine if there is a way to temporarily install a
BGA onto a test board using some type of conductive adhesive to make
electrical contact, electrical test and then safely remove the adhesive
without damaging the solder balls and be able to use the BGA.



Sounds impossible but I informed the design group I would check out the
options.



The other option we are looking at is to design a clamp/pallet that will
securely hold the BGA to the board.  The problem here may be making 100%
electrical contact on all 48 balls.



Anyone have any creative ideas they would like to share? Test sockets are
not an option.





thanks

Joe






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