TECHNET Archives

August 2007

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0 (Apple Message framework v752.3)
Sender:
X-To:
TechNet E-Mail Forum <[log in to unmask]>, "Bloomquist, Ken" <[log in to unmask]>
Date:
Wed, 15 Aug 2007 11:24:24 +0100
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Graham Naisbitt <[log in to unmask]>
Subject:
From:
Graham Naisbitt <[log in to unmask]>
In-Reply-To:
Content-Type:
multipart/mixed; boundary=Apple-Mail-12-560350770
Parts/Attachments:
text/plain (1481 bytes) , text/plain (3556 bytes)
Techies

Apropos the earlier exchange, take a look at this link: http:// 
news.bbc.co.uk/1/hi/technology/6946042.stm

Maybe all will be well with the XBox in 2011?

How about this curious problem: I have a client suffering from an  
apparent refusal of the tin and lead to meld together in his process  
but on on 1 to 10 individual joints per assembly. It looks like a  
cold joint (stay off this Dewey!) yet the joint is hard but separated  
metals - anyone got any clues? Pretty much every conceivable test has  
been run without a solution.

What could prevent tin and lead melding - Mr Hillman or Mr Pauls?

Kindest regards
Graham Naisbitt

[log in to unmask]

www.gen3systems.com

Phone: +44 (0)12 5252 1500
Mobile: +44 (0) 79 6858 2121


---------------------------------------------------
Technet Mail List provided as a service by IPC using LISTSERV 15.0
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815
-----------------------------------------------------



Gen3 Systems Limited Unit B2, Armstrong Mall Southwood Business Park Farnborough Hampshire GU14 0NR - UK ENGINEERING RELIABILITY IN ELECTRONICS Registered Number: 4639449 (England & Wales). Registered Office as above. DISCLAIMER : This message is intended only for the use of the individual or entity to which it is addressed and may contain information which is privileged, confidential, proprietary, or exempt from disclosure under applicable law. If you are not the intended recipient or the person responsible for delivering the message to the intended recipient, you are strictly prohibited from disclosing, distributing, copying, or in any way using this message. If you have received this communication in error, please notify the sender and destroy and delete any copies you may have received. Any views or opinions presented in this email are solely those of the author and might not represent those of Gen3 Systems Limited. Although Gen3 Systems Limited has taken reasonable precautions to ensure no viruses present in this email, Gen3 Systems Limited can not accept the responsibility for any loss or damage arising from the use of this email or attachments. On 13 Aug 2007, at 18:50, Bloomquist, Ken wrote: > I thought this was worth sharing. The Chicago Tribune has an article; > "Coolest electronic gear way to hot for its own good". In the article > they write: > > "The Xbox's failure problem has generated more than 1,100 > complaints to > ConsumerAffairs.com, an online publisher of consumer news and recall > information. > > Adam Carpentieri, who said his online repair site, Xbox360- > pros.com, had > fixed more than 2,000 systems, surmised that the culprit was the > lead-free solder Microsoft used to comply with European Union > standards > for reducing hazardous materials in printed circuit boards. > > As the solder repeatedly heats and cools, it cracks away from the > circuit board's tiny copper connections, causing them, in turn, to > separate and fracture." > > Could that possibly be? > > KennyB > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 15.0 > To unsubscribe, send a message to [log in to unmask] with following > text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail > to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/ > archives > Please visit IPC web site http://www.ipc.org/contentpage.asp? > Pageid=4.3.16 for additional information, or contact Keach Sasamori > at [log in to unmask] or 847-615-7100 ext.2815 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 15.0 To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-615-7100 ext.2815 -----------------------------------------------------

ATOM RSS1 RSS2