TECHNET Archives

June 1998

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Mime-Version:
1.0
Sender:
TechNet <[log in to unmask]>
Subject:
Low-melt solder alloys for desoldering
From:
Tenison Stone <[log in to unmask]>
Date:
Wed, 24 Jun 1998 07:15:50 -0500
Content-type:
text/plain; charset=us-ascii
Reply-To:
"TechNet E-Mail Forum." <[log in to unmask]>, [log in to unmask]
Parts/Attachments:
text/plain (25 lines) 
Hi everyone,

I would like your opinions and experiences using low-melt solder alloys for
rework of smd.  The mixture contains tin, lead, and bismuth.  What
potential problems are associated with this combination?

Thank you for your help.

Tenison Stone
Telex Communications
Blue Earth, MN
507-526-3205

################################################################
TechNet E-Mail Forum provided as a free service by IPC using LISTSERV 1.8c
################################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in the body:
To subscribe:   SUBSCRIBE TechNet <your full name>
To unsubscribe:   SIGNOFF TechNet 
################################################################
Please visit IPC web site (http://jefry.ipc.org/forum.htm) for additional information.
For technical support contact Hugo Scaramuzza at [log in to unmask] or 847-509-9700 ext.312
################################################################

ATOM RSS1 RSS2