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Date: | Sat, 22 Feb 1997 12:13:18 -0500 (EST) |
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In the old days, I personally soldered 316 stainless very successfully using
phosphoric acid as the flux. I don't know if you can use this in an assembly
application, however, it is an option. Hope this helps...
Dave Rooke
Circo Craft - Pointe Claire
________
> Hi Christer -
>
> Good luck on soldering to the stainless steel - it's one of the
> tougher materials to solder to and takes a very aggressive flux
> chemistry. I can help out with your stainless steel questions - CRES
> stands for Corrosion Resistant Steel which is a common acronym for
> stainless steel. Your 18-8 description of stainless steel covers a lot
> of alloys - 303 is a specific stainless steel alloy that is for free
> machining applications. It has a lower sulfur content and a small
> addition of aluminum to promote the free machining aspects. The CTE of
> 303 is 16.4 um/mK in the 21-315 C envelope and 18.5 um/mK in the
> 70-1000 C envelope. With the ceramic having a CTE 7.74 um/mK of your
> assessment of the cracking cause sounds plausible.
>
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>______________________________ Reply Separator
_________________________________
>Subject: Stainless steel
>Author: [log in to unmask] at ccmgw1
>Date: 2/19/97 12:19 PM
>
>
>Dear Technetters.
>
>We have been trying to solder a connector of plated stainless steel to a
>ceramic substrate. We have not been sucessful so far.
>Cracks occur in the solder joint after soldering.
>We think the coefficient of thermal expansion in the stainless steel is
>to high.
>The material in the connector is CRES 303. (Acc to ASTM 484 and 582)
>What material is the connector made of? The supplier is an american
>company.
>
>The CRES 303 says nothing to me.
>Is the material an ordinary 18-8 stainless steel (18%NI and 8%Cr)?
>In that case the coefficient of thermal expansion is approx 18 ppm and
>that could explain the cracks.
>
>Regards
>Christer Marklund
>
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