Sender: |
|
X-To: |
|
Date: |
Wed, 13 Oct 1999 14:58:45 -0700 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
7bit |
Content-Type: |
text/plain; charset="iso-8859-1" |
From: |
|
Parts/Attachments: |
|
|
Don
Ah, gosh, again a question from the past that I don't have values to. I was
doing TAB with ~100um wide leads, and the pull strength was about 25-100
gm/lead (again, if memory serves me). Even so, I wouldn't have done 42
gauge (how big is that in metric terms) copper wire. Regardless, YOU NEVER
WANT THE WIRE TO PULL AWAY FROM SOLDER! That's a failure. You want either
the wire to break far (at least a few mm) from the pad, or you want the pad
to pull off the substrate.
Having had to get some numbers without the proper tools, I found you can do
a garage experiment by attaching a strong clip (like a vise-type paper
clip), tie a string, and hand weights. Don't forget to get it to hand
perpendicular to the bond (that's the weakest direction). It sounds hokey,
but the numbers are within 30% of a "industrial" set up (I had a
collaborator elsewhere). Or you can spend lots of bucks and get the same
number.
-----Original Message-----
From: Steffen, Don E <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, October 13, 1999 1:47 PM
Subject: [TN] Pull Strength Value
>Techno's
>
>I have an anomaly that I wonder if anyone out there can help me with. My
>customer is asking me to come up with a Pull Strength value. The
discription
>of the anomaly is that I have a 42 gauge, Copper ciol wire that is hand
>soldered to a gold plated terminal. I need to quantify the strength of the
>solder bond of the 42 gauge wire that is soldered to the gold lead. I want
>to due a pull test of the wire with a Chillion Pull gage. Does anyone out
>there know what the value that is considered to pull a wire away from
>solder? How is this test performed?
>
>Senior Quality Engineer
>VDO Control Systems
>Auburn, IN 46706
>Phone (219)925-8887
>Fax (219)925-8710
>Email: [log in to unmask]
>
>##############################################################
>TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
>##############################################################
>To subscribe/unsubscribe, send a message to [log in to unmask] with following
text in
>the body:
>To subscribe: SUBSCRIBE TECHNET <your full name>
>To unsubscribe: SIGNOFF TECHNET
>##############################################################
>Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
>information.
>If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
>847-509-9700 ext.5365
>##############################################################
>
##############################################################
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8c
##############################################################
To subscribe/unsubscribe, send a message to [log in to unmask] with following text in
the body:
To subscribe: SUBSCRIBE TECHNET <your full name>
To unsubscribe: SIGNOFF TECHNET
##############################################################
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information.
If you need assistance - contact Gayatri Sardeshpande at [log in to unmask] or
847-509-9700 ext.5365
##############################################################
|
|
|