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July 1998

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Subject:
Surface to hole ratio of copper plating
From:
Jason Zhao <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 1 Jul 1998 08:11:34 -0700
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (23 lines) 
Hello, everyone.
I am doing a project to improve our capability and overcome the
overplating issues in copper plating. the vendor suggested us to reduce
the number of anodes to lower the surface to
hole ratio. Would that help? What are the other factors that affect the
surface to hole ratio? we are using electrochemicals PC-667 acid
copper.
Thank you in advance.

Ja

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