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July 1998

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TechNet <[log in to unmask]>
Subject:
Surface to hole ratio of copper plating
From:
Jason Zhao <[log in to unmask]>
Date:
Wed, 1 Jul 1998 08:11:34 -0700
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"TechNet E-Mail Forum." <[log in to unmask]>, Jason Zhao <[log in to unmask]>
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Hello, everyone.
I am doing a project to improve our capability and overcome the
overplating issues in copper plating. the vendor suggested us to reduce
the number of anodes to lower the surface to
hole ratio. Would that help? What are the other factors that affect the
surface to hole ratio? we are using electrochemicals PC-667 acid
copper.
Thank you in advance.

Ja

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