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March 1999

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TechNet <[log in to unmask]>
Subject:
ENHANCED AgPd
From:
Gabriela Bogdan <[log in to unmask]>
Date:
Thu, 11 Mar 1999 21:46:14 +0200
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"TechNet E-Mail Forum." <[log in to unmask]>, Gabriela Bogdan <[log in to unmask]>
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Dear TechNetters
I need information about "Enhanced silver palladium finish" on MLC's.
How does it live through reflow or wave?
What precautions are needed during repair?
What solder paste is best?
Is it necessary to adjust the reflow profile?
Thank you,
Gaby

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