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| Date: |
Thu, 3 Jun 1999 11:01:29 +0000 |
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7BIT |
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text/plain; charset=US-ASCII |
| Subject: |
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| From: |
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1.0 |
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| Organization: |
University of Salford |
| Comments: |
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Hello,
Could anyone please tell me the temperature's, pressure's, and the dwell
time involved with thermocompression bonding for bonding flip-chip's to
substrates. Also any potential manufacturers of this type of
equipment
Thanks very much
Gareth Jones
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