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Date: | Wed, 24 Jun 1998 07:41:45 -0600 |
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I just started researching this subject myself. Common problems cited is
are a wide range of melting points and some embrittlement from
intermetallics.
Take a look at this
http://www.tms.org/pubs/journals/JOM/9605/McCormack-9605.html for info on
Sn/Pb/Bi. Feel free to e-mail me personally if you wish to compare notes.
Mark Harrand
-----Original Message-----
From: Tenison Stone <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Wednesday, June 24, 1998 6:10 AM
Subject: [TN] Low-melt solder alloys for desoldering
>Hi everyone,
>
>I would like your opinions and experiences using low-melt solder alloys for
>rework of smd. The mixture contains tin, lead, and bismuth. What
>potential problems are associated with this combination?
>
>Thank you for your help.
>
>Tenison Stone
>Telex Communications
>Blue Earth, MN
>507-526-3205
>
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