Everybody has answered your question in a similar way, let me answer
slightly differently
Immersion gold can't be more than 0.0something microns thick, so as a guide
number:  something like 6 - 10 times the thickness you have now.
Sufficient margin not to worry about Au embrittlement anyway

Regards

Mike


Bonding Services & Products
T/M: +44 [0] 1865 522 663 E: [log in to unmask]



-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Victor Hernandez
Sent: Thursday, February 02, 2012 3:38 PM
To: [log in to unmask]
Subject: [TN] ENIG thickness

Fellow TechNetters:

   At what ENIG thickness will the gold not be totally consumed by the
soldering process on a connector lead, LF solder joint.   What happens when
the gold is not consumed.  Will the joint structure be compromised.   What
about the IMC formation.  The SJ strength.

Victor,


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