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September 1999

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Subject:
From:
Paul Klasek <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 13 Sep 1999 11:33:00 +1000
Content-Type:
text/plain
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text/plain (60 lines)
If you're talking Alpha Level process (?):
1
good solderability (as HASL(even no cleans bite well) , planarity .
2
they don't hold as well in store as NiAu (say use within 6 months sealed)
3
very sensitive (more than osp!) on touch ; the finger acid breaks the seal
and than the silver tarnishes very fast.

4
doesn't like multipass (obviously) ; experiment prior to double side process
.

-----Original Message-----
From: Carl Ray [mailto:[log in to unmask]]
Sent: Saturday, 11 September 1999 21:41
To: [log in to unmask]
Subject: [TN] SMOBC Explain


Hey Guys,
Got a question. I have to start running some PCBs that have Organo-Metallic
Silver Immersion for plating. What are the pros and cons? Will I have to use
OA solder paste? Any information will be beneficial.
Carl Ray
Engineering  Supervisor
256-494-3247 Direct line
256-492-8997 ext. 272
256-494-0625 Fax
[log in to unmask]

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