Rich,

I have found the damage you are describing occurs during handling, not
shipping.  If you are using wire racks
or verticle board transports, these are usually where board edge components
get whacked and the damage is
ripped off pads and missing components.  Sliding instead of lifting is the
normal culprit.  I'd check
your process to see what type of board transport is being used and then hold
a little training session
for the operators so they are aware of what the problem is and how it
happens.

DT



-----Original Message-----
From: Rich Lasko [mailto:[log in to unmask]]
Sent: Wednesday, April 18, 2001 6:41 AM
To: [log in to unmask]
Subject: [TN] Shipping Damage on SMT components


Good morning everyone!

I am currently investigating a customer return due to suspected shipping
damage.  Two components in particular have been damaged.  One component is a
SMT bridge rectifier (DF06S) on the primary side of the assembly.  This side
uses solder paste and is reflowed.  The other component is a SMT diode
(DL4007) on the secondary side of the assembly.  This side is glued and wave
soldered.  The returned assemblies have either one or the other of the above
components "torn" or "partially torn" from the pcb.  Torn includes the
component, component pad, and attached trace(s) that have been dislodged
from the pcb.  Both components are located near the edge of the pcb.  It
would appear that this type of damage would take quite a bit of force to
dislodge a low profile SMT component from the pcb with the pads and traces
attached.  The shipping boxes nor static shielding bags appear to have been
"excessively" damaged.  (No apparent holes, punctures, etc...).  Each
assembly is bagged separately in a static shielding bag and packaged in
individual "slots" in the shipping box.  The board size is approx. 4" x 4".

My questions are these:

1.) Has anyone else experienced this type of damage to low profile SMT
components?  If so, what was the cause and resolution?
2.) Does anyone have an idea on how much force would be needed to dislodged
these type components from the pcb?



Please advise.

Thanks in advance for your responses.

Rich Lasko
Badger Electronics

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