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Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 22 Apr 1998 05:52:42 -0500 |
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Graham,
Those suppliers of our who make Al backed teflon boards do not strip the
zincate prior to E/L Ni. A strong caustic cleaner should activate the
aluminum surface. Back in a stone aged past life, we stripped anodized
aluminum using strong caustic.
Regards,
Dave Sullivan
Rockwell Collins
[log in to unmask] on 04/21/98 08:31:59 PM
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cc: (bcc: David D Sullivan/CedarRapids/Collins/Rockwell)
Subject: [TN] Copper/Aluminium Clad Teflon Plating
Copper/Aluminium clad Teflon Plating
Specifically, my query concerns plating 0.5oz to 1oz copper on Teflon
with 1/8 to 1/4 Aluminium back (6061).
What is the best method of activating the Aluminium surface prior to
plating without using a nitric desmut, as this attacks the copper
surface.
or
What can be used for removing the smut on the Aluminium surface after
etching in a potassium fluoride etch which will not attack the copper
surface.
How can I achieve maximum adhesion of electroless nickel on Aluminium,
such as double dipping in Zincate. without stripping the Zincate with
Nitric
Thanks in advance
Graham Savage
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