No problem so long as you pre-tin the terminals once before making the
solder joint.  Hi-Rel applications require double-tinning of gold plated
terminations prior to making the solder joint.  Per IPC-J-Std-001C, if gold
plating is less than 100 microinches (2.5 micrometers), the double
pre-tinning of wiring terminals to remove gold is not required. (Tinning
once is still required)
I would suggest determining the plating thickness.  The cost of this effort
could offset the additional cost and time to double tin all the terminals.
Most likely, the terminal plating will be much thinner than 100 microinches
due to economics and the price of gold.  Even Mil-Spec. connector solder
cups are only 50 microinches.
Hope this helps,
R. G. Blomberg
Honeywell -SASSO
Staff Production Engineer
(727) 539-5534 voice
727-539-4469 Fax
[log in to unmask]



-----Original Message-----
From: Kenny Bloomquist [mailto:[log in to unmask]]
Sent: Thursday, August 12, 1999 6:39 PM
To: [log in to unmask]
Subject: [TN] Soldering Gold Terminals


ANSI/J-STD-001 basically says that gold plated through hole and surface
mount components need to be cleaned by solder dipping or wave.

My question is, are there any guide lines for soldering wires to gold
plated pierced or perforated terminals (plating thickness is unknown).
These are typically very small (thin) and there is a wire going through the
hole that doubles back on its self. This is soldered with a goodly amount
of solder.

Any problem?

Ken Bloomquist
Sr. Principal Process Engineer
PRIMEX Aerospace Company
P.O. Box 97009
Redmond, WA 98073-9709
http://www.primextech.com

Ph:   425-885-5000
FAX: 425-882-5786
[log in to unmask]

Northcon/2000, Board Member
http://www.northcon.org

Electronics Manufacturers Association (EMA), Vice President
http://www.ema-wa.org

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