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December 1997

TechNet@IPC.ORG
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Sender:
TechNet <[log in to unmask]>
Date:
Wed, 10 Dec 1997 16:56:53 +0000
Reply-To:
"TechNet Mail Forum." <[log in to unmask]>, tana <[log in to unmask]>
Content-type:
text/plain; charset=US-ASCII
Subject:
IPC standards for stencil printing
From:
tana <[log in to unmask]>
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1.0
Organization:
University of Salford
Comments:
Authenticated sender is <[log in to unmask]>
Parts/Attachments:
text/plain (22 lines) 
Dear Techneters,

I would like to know if there are any IPC standards/guidelines on
criteria used to qualify solder paste stencil printing. If there are
any, please point me to the right directions.

Thanks
Tennyson Nguty, AeroMech Department, Newton Building, Salford University
Manchester M5 4WT, UK. Tel: 0161-745 4696/5951, Fax: 0161-295 5575/5108

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