I mistakenly sent a pretty ugly picture of a x-section to Paul Classic and
Big Steve Gregorme. It showed, for those of you not offended, a 30 plus
layer board with about 5% filling in a board so thermally dense it froze the
solder pot. IPC cannot cover that. No one can unless it functions as the
customer required and was willing to buy. However, this practice does not
even come close to DFM/CE principles.

Earl Moon
----- Original Message -----
From: Vincent BADA <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, September 29, 1999 11:32 PM
Subject: [TN] Wave soldering


> Hi all,
>
> What is the minimum vertical fill of solder for plated through holes ?
>
> We have some problems to obtain the 75% requested by IPC-A-610 for a class
2
> board.
> In fact, the board has a thickness of 3,2 mm.
> We use a no-clean flux and the wave is under nitrogen.
>
> Is there any special criteria regarding to the thickness of the board ?
> Has anyone succeeded in obtaining a correct solder filet for thick boards
?
>
> Thanks,
>
> Vincent Bada
> Process Engineer
> Alcatel Etca
> Charleroi
> Belgium
>
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