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May 1998

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Subject:
From:
"Gerald G. Gagnon" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 5 May 1998 11:57:53 -0400
Content-Type:
text/plain
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text/plain (27 lines)
Hello All

I am in need of density values for:

Electrolytic "hard" gold used for card edge fingers
Electrolytic "soft" gold used for wire bonding
Immersion gold used for solderable surface

The above would reflect the deposit metallurgy typically expected for
each end use.

Thanks and regards

Gerry

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