Also remember that BSDL is only applicable to less than 5% of the
component market, and that is being gracious. Also, can you afford,
as a designer, to allocate 3-4 I/Os for BSDL. Every component company
is different. If you have ASICs, then BSDL is a viable alternative.
From our application it is not advantageous. I've breifly read and
discussed with others that BDSL has the ability to test surrounding
components since they lie within that Net.
BSDL is great, but you will need to use in combination with other
testing, preferably cell testing (AOI, AXI, ICT, FLYING
Probe,Functional, etc.). A combination of test cells will yield good
in-product stats.
regards,
John Gulley
______________________________ Reply Separator _________________________________
Subject: Re: [TN] Elcetrical Testing
Author: "Gagrani; Kishore" <[log in to unmask]> at Internet
Date: 5/4/98 4:15 PM
Dennis,
After mounting BGA on a board you can actually test it on ICT using
boundry scan (As is used by Genrad) test techniques. You can get more
info. On this from Genrad .
Thanks
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, May 04, 1998 3:59 PM
To: [log in to unmask]
Subject: [TN] Elcetrical Testing
From: Dennis J Fall@TFT on 05/04/98 02:59 PM
To: [log in to unmask]
cc:
Subject: Elcetrical Testing
What are some ways that BGA manufacturers test the BGA's. I assume
there
must me some way to electrically test the product both for pieces that
have
been mounted to PCB's (customer simulation) and those that have not
yet
been mounted (shipping type tests). I would think some sort of a
socket
apparatus would be used to test the pieces before they are mounted to
PCB.
But I am not sure how the pieces would be tested after they are
mounted.
Thank You,
--
Dennis Fall
Thin Film Technology Corporation
1980 Commerce Drive
North Mankato, MN 56003-1702
Phone: 507-625-8445 x17
Fax: 507-625-3523
http:\\www.thin-film.com
mailto:[log in to unmask]
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