RE: [TN] WARPAGETo answer Franklin's comment on the board being warped after assy, YES it most assuredly matters. Especially if your boards are mounted into a backplane on rails. Even small amounts of distortion or warpage can give you problems in getting the board to mate to the backplane connector. Previous employment we used a 21 station Hybercon backplane and I will tell you we had issues with board warpage and not making to the Backplane connectors.
Glenn I believe you are correct, but this would depend on board application and specific requirements
from the customer. Using vacuum as a hold as part of your process you would want the board as flat as possible to insure even coating application.
You are better being tolerance tighter in the beginning so you can ease up a bit latter. Near impossible to go backwards.
Regards,
Randy Bock Sr.
Bryce
Quality Manager
[log in to unmask]
----- Original Message -----
From: Glenn Pelkey
To: [log in to unmask]
Sent: Monday, October 28, 2002 12:13 PM
Subject: Re: [TN] WARPAGE
We apply IPC-6015 to much of our product, which requires 0.5%. After SMT, there are a number of fixtures that require the board to be flat for vacuum hold down or epoxy dispense processes.
Now tell me if I'm interpreting this wrong. I apply the 0.5% limit at incoming, and apply the 0.75% limit after SMT. Sound correct?
Glenn
-----Original Message-----
From: Franklin D Asbell [mailto:[log in to unmask]]
Sent: Monday, October 28, 2002 8:31 AM
To: [log in to unmask]
Subject: Re: [TN] WARPAGE
Would that criteria also apply to "populated" boards? I believe he was seeking data for populated boards...curious...would it matter after assembly if they were warped or not???
Franklin
----- Original Message -----
From: Eric Castonguay
To: [log in to unmask]
Sent: Monday, October 28, 2002 10:14 AM
Subject: Re: [TN] WARPAGE
Pankaj,
check in IPC-6012 par. 3.4.4 Bow & Twist. The printed board shall have a maximum bow & twist of 0.75% for boards that use SM components and 1.5% for all other boards. Also, see test method 2.4.22 described in the "IPC-TM-650 test methods manual" on how to measure it.
Eric Castonguay, Eng.
Manufacturing Engineering
www.Hyperchip.com
Montreal, Canada
T. 514 906 2409
F. 514 906 2501
-----Original Message-----
From: Karnwal, Pankaj [mailto:[log in to unmask]]
Sent: Monday, October 28, 2002 02:02
To: [log in to unmask]
Subject: [TN] WARPAGE
> Hi TechNet
>
> Can any body give me the acceptable range of PCB {Populated } For
> Warpage, { Both Throughole And SMD And MIX components} .And how we can
> measure it. Also tell that what IPC states about this.
>
>
> With regards
> Pankaj Karnwal
> Quality Assurance Ext. 211
> BESL A-4,Sec-5 NOIDA , 201301, INDIA
> e mail : <mailto:[log in to unmask]>
> Barco, innovators in image processing
>
>
>
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