Could be a long shot, but there are ICT probes that are very sharp, even
that twist as they are depressed.
Usually for probing 'non-ideal' test pads. I don't know if they are
aggressive enough to break through the mask though.
Could be worth suggesting to your testers.
(I'm assuming that there is a large no of boards involved here, and the
scalpel blade method would be too labor intensive. Otherwise, happy scraping.)

Phil.

At 08:56 13/09/99 -0400, you wrote:
>hello everybody,
>
>I have run into a slight dilema, boards that we are building have several
>vias soldermasked that are needed for ict testing. This raises several
>questions:
>1)Is it possible to remove mask from vias?
>2)If so is this something that can be outsourced?
>3)How much would it cost?
>4)what are the reliabilty effects of doing this?
>
>thanks in advance.
>
>john koleszar
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===============================================================

Phil Dutton C.I.D.
Senior CAD Technician
IPC Certified Interconnect Designer
Vision Abell Pty Ltd
Second Avenue, Technology Park,
Mawson Lakes.  SOUTH AUSTRALIA  5095

Phone :         (08) 8300 4400 (reception)
                (08) 8300 4481 (direct)
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Internet Page:  http://www.vsl.com.au

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